Used BLANCHARD Grinding Machine #9128211 for sale

BLANCHARD Grinding Machine is an industry-leading wafer grinding, lapping and polishing equipment developed by BLANCHARD International. It utilizes the latest in advanced technology to provide the highest precision and quality of any wafer grinding, lapping and polishing machine on the market. The most notable feature of Grinding Machine is its superior precision due to its patented grinder and lapping head design and advanced CNC precision-controlled system. Using the integrated X and Y-axes, the unit is capable of providing unmatched accuracy and repeatability even in the most demanding applications. The integrated CNC driver ensures the most reliable and consistent execution of operations on-site. This allows for a fully automated machine and includes a full suite of features such as preset grinding patterns, grind data storage and profile adjustments. Furthermore, the tool is suitable for a wide variety of wafer materials such as GaAs, Si, Ge, and SiC. The asset is also low maintenance, featuring its planetary grinding wheel design and twin-drive motor model for improved reliability. The self-cleaning grinding wheel equipment removes debris automatically and minimizes downtime, while the built-in dust removal system provides a clean and safe working environment. The use of a hydraulic lift and automated linear drive ensures smooth and precise roller movement across the surface of the wafer in both X and Y-axes. To ensure the best results, the unit operates in both dry and wet grinding modes. In the dry grinding mode, the machine is designed to maintain a consistent temperature level through variable speed tool controls, cooled water flanges, and a special grinding innovation. In the wet grinding mode, the asset features a patented polymer platform to reduce friction and increase efficiency. The polymer platform also prevents thermal oxidation and contamination, providing more reliable results. In conclusion, BLANCHARD Grinding Machine is an advanced wafer grinding, lapping and polishing model that provides unmatched precision and power for applications requiring ultrafine surface finishes. Its advanced design and features provide a reliable, low maintenance equipment that is suitable for a wide variety of wafer materials and grinding modes. The system is capable of executing operations while maintaining precise accuracy and repeatability, all while providing a safe working environment.