Used BLANCHARD II #9268066 for sale

BLANCHARD II is a wafer grinding, lapping and polishing equipment — a precision machine that produces high accuracy, high performance surfaces on both front- as well as back-side surfaces of wafers. The system is based on the same principles as a BLANCHARD Grinder where the feed table and work head of BLANCHARD Rotary Table IITM are combined with the technology of a CMP unit; allowing full control over all parameters for the grinding, lapping and polishing process during wafer production. The basic structure of II consists of a main tube, a spindle assembly, a chucking machine, a drive motor, vacuum tool, and control panel. The main tube is constructed from grade A crankshaft steel and is supported by heavy-duty sealed bearing assemblies. The spindle assembly is made up of an adjustable bearing cartridge, internal gears and a brushless DC servo motor. The motor provides a variable range of speeds and enables the user to adjust the spindle as needed. The chucking asset is made up of an adjustable chuck with three opposed segments and a vacuum clamp designed for fast wafer loading and unloading. The vacuum model is equipped with a venturi vent and gauge and utilizes a three-stage filtration process to ensure clean and sterile air. In order to ensure accurate grinding, lapping and polishing, BLANCHARD II is equipped with a set of four high-precision PLC's, comprising of servo-motor control, vacuum control, motor regulation, and soft-start/stop functions. The four-axis motion control equipment is also included — providing the highest degree of control available for describing movement through space and manipulating the active head of the system. The software of the PLC controls the axis-motion and grinding head reference position in all four stages of the process, performing calculations of rates, positions and depth of cut, as well as other parameters for the grinding and lapping process. II is a sophisticated unit specifically designed for precision grinding, lapping, and polishing of wafers. It is optimized for quick change-overs and flexibility and can handle an array of different materials. The machine is highly reliable, accurate and cost-effective and offers the user a quick and reliable way to produce high accuracy, high performance wafers.