Used BLUE VALLEY 60B #9113616 for sale

BLUE VALLEY 60B Wafer Grinding, Lapping and Polishing equipment is a highly automated and cost-efficient machine. It is designed to quickly process wafers in a variety of grinding, lapping, and polishing applications. The application range includes planar (polishing of optical surfaces), dicing/deburring, and many other wafer grinding operations. 60B is a standard model, being one of the most compact systems available with a compact size of only 1200 x 600 mm. The system can process a wide range of wafer sizes, up to 300 mm in diameter, and is capable of handling a high throughput of up to 60 wafers per hour. The unit includes an automated feeder station, an inclined platform with two lapping discs, a rotary-grinding table, and a polishing head with an adjustable speed and adjustable pressure. The machine requires minimal maintenance, only needing occasional lubrication or cleaning. It is designed for ease of use by the operator, with a robust controller, advanced onboard diagnostics, and intuitive programming via the graphic user interface. The user can easily program the tool for a range of operations and easily adjust parameters to fit the application. The controller is capable of controlling the grinding, lapping, and polishing speeds, as well as the pressure of the polishing head. In addition, the asset has a dust collection hose for dust-free grinding, lapping, and polishing. BLUE VALLEY 60B is well-suited for a variety of applications, such as lapping and polishing of sapphire wafers, grinding wafers with a dry abrasive material, and back-grinding of various materials. This model offers an efficient, safe, and reliable method to achieve a high quality surface finish. In addition, the equipment is affordable, allowing small companies and universities to take advantage of the sophisticated technology.