Used BODINE 24ABEPM-Z4 #9153425 for sale

BODINE 24ABEPM-Z4 wafer grinding, lapping & polishing equipment is designed for precision and extremely accurate processing of semiconductor wafers. It is an excellent choice for applications requiring a high degree of flexibility in variable precision. This system features a high level of repeatability, enabling precise outcomes from the same batch of wafers. BODINE unit utilizes a diamond grinding wheel for initial wafer grinding. A consistent force is applied to the wafer in a controlled, uniform manner to achieve uniformity across the entire wafer's surface. Following the grinding stage, the wafer is then lapped and polished with a polishing stone. This processes removes any remaining micro-asperities and imperfections on the wafer's surface. To ensure accuracy and repeatability, 24ABEPM-Z4 is outfitted with a high precision chuck capable of consistently applying precise force and motion against the wafer. The chuck is enclosed in a dielectric protection chamber to protect the wafer from contamination due to airborne particles. Additionally, the chamber is temperature regulated so that it stays within a consistent range throughout the entire process. BODINE 24ABEPM-Z4 is equipped with a powerful and precise PID feedback control machine that allows for the automated management of the entire process. The controller features a number of customizable settings which enables users to adjust the speed, temperature, and pressure of the grinding, lapping and polishing phases. This controller also features a comprehensive display allowing for easy monitoring, error detection and adjustment of the process. In summary, 24ABEPM-Z4 is an excellent choice for precision wafer grinding, lapping and polishing, featuring a number of powerful features suitable for the industry's demands. Its comprehensively designed feedback control tool, temperature regulated chamber and repeatable outcomes make this asset an ideal choice for users looking for reliable, consistent performance.