Used BODINE 42A5BEPM-E3 #9385514 for sale

BODINE 42A5BEPM-E3 is a wafer grinding, lapping and polishing equipment that is capable of achieving tight dimensional tolerances, superior surface finishes, and superior geometry for a variety of wafer applications. The system uses a versatile setup and a wide variety of grinding/polishing media to meet changing production requirements. This unit is highly automated and efficient, providing automated grinding/polishing media loaders, automated material handling, and automated wafer transport for high speed, low cost operation. 42A5BEPM-E3 is a full-featured wafer grinding, lapping and polishing machine. It is designed to grind, lap, and polish multiple wafers at high throughput rates with precision. The tool is designed with a variable speed drive and uses advanced control systems. This provides the flexibility to handle a variety of grinding/polishing operations on the same machine. The asset is equipped with a direct drive spindle motor which provides smooth and stable operation with reduced wear. It also features a powerful air bearing spindle motor for precise, low noise grinding/polishing processes. BODINE 42A5BEPM-E3 utilizes a variety of grinding plates, grinding wheels, and polishing pads for different types of wafer material and edge requirements. It also features a diamond chamfering wheel for superior surface finishing results. 42A5BEPM-E3 utilizes an advanced automatic abrasive replenisher to reduce the need for manual replenishment during operation, and minimizes abrasive contamination. The model is designed with a full range of safety and environmental control systems. This includes an advanced environmental monitoring equipment, an emergency shut down system, and an integrated dust collection unit. BODINE 42A5BEPM-E3 is designed to handle multiple wafers per cycle. It is capable of processing up to 20 wafers per cycle, and can process up to 240 wafers per hour. The machine is designed for high speed operation with accuracy, providing repeatable accuracy for consistently superior results. 42A5BEPM-E3 is designed for maximum efficiency and cost savings. It is a cost effective wafer grinding, lapping and polishing solution for a wide variety of wafer processing needs. The tool is designed for maximum flexibility, accuracy and safety, making it an optimal choice for any number of wafer processing operations.