Used BODINE 42A5FEPM-E3 #9156731 for sale

BODINE 42A5FEPM-E3 wafer grinding, lapping, and polishing equipment is a rigid, reliable, and precise machine designed to offer industry-leading solutions for wafer processing to achieve the highest polish quality. It is the ideal machine to meet the demanding requirements of the semiconductor manufacturing process. This fully automated wafer grinding system includes an 8" thru-feed grinding wheel, an 8" in-feed grinding wheel, and a wafer lapping head. Its modular design allows for maximum flexibility, allowing users to configure the unit to process up to 20 wafers in a single station. The machine is also capable of processing silicon, silicon-on-insulator (SOI), quartz, and sapphire wafers. 42A5FEPM-E3 tool includes a sophisticated CNC-controlled feed drive to eliminate manual feed rate discrimination. The asset also includes a precision air bearing slide model, providing precise control and consistent surface finish across all wafers. The advanced grinding process monitors grinding, lapping, and polishing performance and includes a digital readout to measure wheel speed, feed rate, and pressure applied to the wafer. The equipment is equipped with a dust extraction and collection system that captures and removes grinding debris from the production environment. It is also equipped with an acoustic hood that reduces overall noise levels, minimizing potential disturbances to personnel and equipment. The wafer grinding, lapping, and polishing unit uses a PC-based touch-screen control machine that allows for easy program manipulation and parameter selection, as well as real-time tool monitoring. The control asset is also integrated with the wafer testing equipment, allowing for the simultaneous testing and grinding process. For accurate and reliable wafer processing, BODINE 42A5FEPM-E3 offers the best combination of precision and reliability. It has a robust construction to give excellent repeatability and offers state-of-the-art technology for wafer grinding, lapping, and polishing. With its intuitive and user-friendly interface, the model offers a reliable, cost-effective solution for industry-leading wafer processing needs.