Used BODINE ASH-402 #9378741 for sale

BODINE ASH-402 wafer grinding, lapping & polishing equipment is an advanced tool for precision wafer preparation. This system is designed to produce high-qourity wafers by grinding flat surfaces and low-stress side edges of a wide variety of materials, including quart, silicon, metal-oxide, gallium-arsenide and ceramic substrates. ASH-402 is equipped with an abrasive wheel with a unique profile, a rubberized wheel to control grinding pressure, and a water-cooled top plate to assist in grinding. The unit is capable of using a diamond grinding wheel, allowing for a precise and repeatable surface finish. This machine also features a fully automated polishing process to ensure repeatable results. BODINE ASH-402 is designed with an adjustable speed control and a 5-axis manual motion control for precise manual grinding and polishing. This machine is able to attain surface flatness ranging from 10nm to 20nm, with surface roughness ranging between 4nm to 50nm. In addition, this tool can achieve a wafer thickness of between 30μm to 250μm and a wafer size range of 10mm to 300mm. The asset is built with a Cleanroom class 5 environment, ensuring a dust-free and reliable operation. ASH-402 also features a user-friendly, operational software for managing the grinding process and monitoring model operations. This software allows for a secure traceability of the individual wafers, as well as adjustable parameters for a tailored wafer preparation. BODINE ASH-402 is an effective, innovative solution for applications in industries such as semiconductor, photovoltaic and optical components. Its simple operation ensures repeatable results, allowing for improved productivity and cost savings in mass production lines.