Used BOYAR SCHULTZ 2A618 #9235523 for sale

BOYAR SCHULTZ 2A618 is a precision wafer grinding, lapping and polishing equipment that can be used for processing smallworkpieces such as such as microelectronic and optical components. The system features a heavy-duty, single-spindle machining center that is designed for grinding, lapping and polishing flat surfaces, including wafers typically used in the semiconductor and microelectronic industries. The machining center features a high precision positioning table that provides a smooth surface finish of +/- 0.0001 inch. The table is driven by direct-drive motors for high speed and accuracy. The machining center is designed to accommodate a wide range of grinding, lapping and polishing wheels and abrasive media to support a variety of materials and finishes. The unit is equipped with a three-axis programmable CNC control machine for automated operations. 2A618 also features a high-capacity lapping and polishing station, which is designed to polish wafers and other flat surfaces to a precise finish. The station is powered by a DC motor for smooth, accurate operation and is equipped with a two-axis linear motion control tool. The asset is designed for gravity feed operation to minimize material wear and maximize efficiency. In addition, BOYAR SCHULTZ 2A618 features a dust collection model for collecting debris from grinding and polishing processes. The equipment is designed with an integrated vacuum port to ensure optimal collection of grinding dust and other debris. The system also features an internally mounted dust filter to reduce air pollution and improve worker safety. 2A618 is ideal for grinding, lapping and polishing small, intricate components including semiconductor wafers. The unit is designed to provide superior surface finishes and extremely tight tolerances for a variety of applications. It is also designed to maximize productivity and reduce labor costs through efficient operation and automated programming.