Used BOYAR SCHULTZ 612-H #9393219 for sale

BOYAR SCHULTZ 612-H
ID: 9393219
Hydraulic surface grinder.
BOYAR SCHULTZ 612-H wafer grinding, lapping and polishing equipment is a high-end tool designed to generate consistent particle size and surface finish on a variety of wafers. This system offers unique features such as a spindle motor for faster grinding and adjustable speed controls for more precise grinding and lapping. 612-H features a heavy duty construction with a portable base that is ideal for transport and storage of the unit. The grinding, lapping and polishing process is achieved by a combination of coarse and fine grinding discs, both diamond and gemstone, and a variable speed drive feature allows for precise and repeatable results. BOYAR SCHULTZ 612-H comes equipped to accommodate a variety of wafer sizes and the ability to use a full range of abrasives, making it a flexible and efficient solution for a wide variety of grinding and polishing applications. 612-H has advanced cooling capabilities that help reduce temperatures during operations, allowing for a more controlled and precise grinding and polishing process, while ensuring consistent abrasive performance over time. BOYAR SCHULTZ 612-H also has improved dust extraction capabilities, ensuring lower levels of dust during operation, helping to prevent contamination. The combination of a precise spindle, high solidity construction, and variable speed drive feature creates a setup that is capable of producing highly accurate surface finishes within ultra-precise tolerances. 612-H machine is designed for fast and efficient process control, and includes innovative features such as automatic rotation of the grinding plates, automatic dosing, and product counting. Moreover, BOYAR SCHULTZ 612-H has the ability to store up to 50 recipes and produce repeatable results with minimal operator input. The intuitive arrangement of the graphical user interface allows for easy operation. 612-H tool is a powerful and reliable tool for the most demanding and precise wafer grinding, lapping and polishing requirements, making it an ideal solution for a variety of industries.
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