Used BOYAR SCHULTZ Pro Grind V #156002 for sale

BOYAR SCHULTZ Pro Grind V Wafer Grinding, Lapping and Polishing Equipment is a state of the art machine for precise and reliable processing of wafer substrates. This system is fully automatic with easy-to-use touchscreen controls. Pro Grind V has the capability of grinding and polishing wafers up to 8" in diameter. This unit features an adjustable grinding head and adjustable grinding force that adjusts the amount of pressure used during grinding operations. The positional accuracy of the grinding head is maintained with an integrated optical feedback unit. The adjustable grinding motion controls provide smooth, reproducible results with each grind. BOYAR SCHULTZ Pro Grind V is equipped with a Variable Frequency Drive motor to control the speed of the grinding head, enabling the user to adjust the speed to achieve the best results. The machine also has an automatic back pressure regulator so that the best grinding results can be achieved even when grinding large wafers. In addition to grinding the tool is capable of lapping and polishing. The two step lapping process ensures uniform lapping results for increased accuracy. The lapping capability includes single and double sided lapping and polishing with a variety of diamond slurries and chemicals. Pro Grind V is a highly efficient, easy to use asset that can quickly and accurately grind and polish wafers. It is specifically designed for optimal performance with a tight tolerance for accurate results and is ideal for applications requiring precise results. The user friendly interface, adjustable grinding head and variable frequency drive motors make this perfect piece of equipment for someone who needs to cut and polish wafers quickly and accurately. This model is ideal for those who need to streamline the process with consistent results.