Used BOYER-SHULTZ H-612 #191946 for sale

BOYER-SHULTZ H-612 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for applications requiring the highest possible standards of surface finish. The system is equipped with advanced features for automated, high quality, consistent and efficient surface preparation processing of a variety of wafer materials. H-612 unit is ideal for applications requiring tolerances as low as 0.1 micrometer. BOYER-SHULTZ H-612 utilizes a three-axis robotic arm that is controlled by a powerful motion controller, and each axis is capable of both linear and angular movement. The machine is equipped with an intelligent grinding and polishing subsystem, which offers a wide range of tools and process parameters that can be custom configured to suit a variety of customer needs. This capability includes the ability to load and unload wafers without any user intervention. The tool also has a fully customizable central controller with a intuitive graphical user interface which allows for easy and precise operation. H-612 is supplied with a set of advanced grinding tools such as diamond abrasives, honing stones, finishing pads, surface conditioning discs and polishing pads. All of these tools are made from highest quality materials and are designed to perform the wafer grinding and lapping operations with the finest precision. The asset is also equipped with special polishing stations which have the ability to apply controlled and programmable pressure to the wafer surface. For safety, the model is compliant with all relevant safety standards, and it also features a user-friendly locking mechanism which prevents access to the interior of the machine. Additionally, the equipment is designed with an integrated ergonomic design to allow for comfortable and effective operation of the system. BOYER-SHULTZ H-612 is also equipped with various monitoring capabilities which help the operator to keep track of performance and efficiency of the unit. Overall, H-612 is an essential tool for automated processing of wafer surfaces which need the highest levels of accuracy and precision. This machine is capable of delivering the best surface finish possible at a cost effective price. With its advanced features, this tool ensures that the highest standards of consistency and surface finish can be achieved, while still delivering operational efficiency.