Used BRIDGEPORT Series I 2J #185022 for sale

BRIDGEPORT Series I 2J Wafer Grinding, Lapping, and Polishing System is a high-end machine capable of achieving excellent results in grinding, lapping, and polishing operations. It is designed to grind, lap, and polish 3 and 4" uni-face and backside devices to high tolerances and accuracy for semiconductor, MEMS, and other industrial applications. The machine is equipped with a 4-axle electric drive with servo motors and precision spindles to handle automated tool changes and to precisely control the cutting forces and speeds. Integrated software provides precise control over polishing pressure as well as lapping and grinding cycles. The machine is able to produce a consistent finish and maintain a high degree of accuracy and attaining superior surface finishing results. The machine also provides a safety feature that shuts off when foreign objects are sensed in the machine, helping to maintain the highest level of safety while producing the best results. Its construction is heavy-duty, with a sturdy base, long-life motors, and reinforced steel components. This ensures the machine will last for many years, even in the harshest of conditions. Series I 2J is environmentally friendly, as it uses an environmentally friendly coolant that is used to reduce friction on the grinding and lapping surfaces. The optimal combination of power and accuracy used in the grinding, lapping and polishing operations help achieve an excellent surface finish. The Integrated Software also allows users to customize the grinding and lapping cycles to suit their specific needs. BRIDGEPORT Series I 2J is a reliable, precise and efficient machine capable of meeting the demands of the most exacting needs. Utilizing advanced technologies and robust construction, Series I 2J will provide superior grinding, lapping and polishing results with ease.