Used BRIDGEPORT Series I 2J #185023 for sale

BRIDGEPORT Series I 2J (2J) wafer grinding, lapping and polishing equipment is a multi-purpose, integrated and automated tool for both research and production. It is fast and accurate and provides consistent results. The system is highly versatile as it can process various kinds of wafers and flat sample materials at different sector sizes with a wide range of shapes including square, round and rectangular. The 2J is equipped with a grinding wheel or disc, lapping plate and two polishers, each designed to ensure optimal performance. The unit uses a PLC-based control machine that allows the users to select and modify their own programs. It also features a touch-screen interface and operational-level monitoring and control of different parameters. Additionally, the tool has features such as automatic grinding head rotation, lapping and polishing operations, as well as automatic speed control. The 2J is designed to process a variety of materials using standard diamond abrasives. The grinding wheel is suitable for grinding oxides and silicates, whereas the lapping plate can be used to lap non-oxides such as silicon and germanium. The two polishers allow for a controlled finishing process for final product adjustment and finish material. The asset is easy to operate and clean. It also has a compact base that can accommodate the process station and the periphery equipment, such as an exhaust model, motor drive or power supply, server and others. Series I 2J is an economically attractive, highly efficient and state-of-the-art wafer grinding, lapping and polishing equipment. It has been designed to meet the needs of both research and production and is an ideal system for applications such as high-precision wafer grinding and polishing, scratch-free surface preparation, and flexible post-finishing operations. The unit can process soft and hard materials with excellent precision, repeatability and yield while maintaining a high level of quality control.