Used BRIDGEPORT Series I #293799162 for sale

BRIDGEPORT Series I is an industrial-grade wafer grinding, lapping and polishing equipment designed to provide consistent and accurate performance. It features high-torque spindle assemblies, premium PLC systems and robust construction for efficient grinding, lapping and polishing of wafers with superior quality. The system also features metrology capabilities with a 3D white light scanner to inspect and measure features on a wafer as per process requirements. Series I unit comprises of a spindle, grinder, lapper, polisher and metrology machine, along with customized and ergonomically designed frames and handling equipment. The high precision grinding spindle is mounted to a heavy duty, dual carriage tool for smooth and powerful grinding and lapping operations. The grinder also comes with electronically adjustable speed, load and inertia control to prevent equipment damage due to process drift. The lapping operation is facilitated by a diamond-based lapping plate with rigid support frame and automatic lubrication, ensuring precise and consistent performance. The polishing operation is also facilitated by the lapping plate, complemented by an advanced polishing platen and a DC motor control asset. The model's metrology capabilities are enabled by a fully automated vision equipment which can be programmed to measure and inspect geometric features on the wafer. The in-line 3D white light scanner processes eight channels simultaneously and can measure features within 5-micron accuracy. BRIDGEPORT Series I combines robust construction and modern engineering to deliver reliable, precise and consistent performance. With its automated handling systems, intuitive operator interface and advanced metrology capabilities, it is an ideal choice for businesses seeking improved performance, efficiency and throughput of their wafer grinding, lapping and polishing operations.