Used BRIDGEPORT Series II #9243119 for sale

BRIDGEPORT Series II
ID: 9243119
Variable speed vertical milling machine.
BRIDGEPORT Series II Wafer Grinding, Lapping & Polishing Equipment is designed to address the challenges of integrated circuit (IC) production and processing. This system combines high-precision grinding, lapping, and polishing solutions to enable ultra-fine surface finishes with the highest yield potential. Series II Unit includes a high-precision spindle and drive coupled with a powerful over-arm design for superior performance and stability results. This construction allows for repeatable, accurate motion for maximum process precision. In addition, BRIDGEPORT Series II Machine features an automatic process control tool. This advanced programmable logic control (PLC) and integrated human-machine interface (HMI) interface allow for a flexible workflow, and allows you to easily monitor and control in-process characteristics. With Series II Asset, you can access complete automation for process control and data logging, providing the highest level of efficiency, accuracy, and traceability. BRIDGEPORT Series II Model's built-in vibration dampening equipment also ensures low levels of vibration, even at higher speeds. This allows the system to operate smoothly and accurately with minimal impact to the high-precision components and processed surfaces. Series II Unit is also equipped with an onboard coolant filtration machine. This ensures that the liquid coolant is properly filtered to provide purity and is free of impurities and dirt particles. This prevents deposits that can lead to surface defects, ensuring a clean, even surface finish without compromised results. As for safety, BRIDGEPORT Series II Tool features several safety features, such as a door interlock asset, which prevents the machine from operating when the door is open. This model also features an emergency stop function and includes safety labels and warnings that are visually visible and clearly stated on the machine. In conclusion, Series II Wafer Grinding, Lapping & Polishing Equipment provides high-precision results while meeting all safety requirements, through its advanced design features. This system allows for repeatable and accurate motion and process precision, while also providing automated process control, data logging, vibration dampening, and coolant filtration. With this unit, you can achieve ultra-fine surface finishes with the highest yield potential.
There are no reviews yet