Used BROWN & SHARPE 1440U #67118 for sale
URL successfully copied!
Tap to zoom
ID: 67118
Vintage: 1983
Universal Cylindrical grinder, 14" x 40"
Specifications:
Maximum Swing over Table: 14"
Maximum Distance Between Centers: 43-3/4"
Table Traverse Speeds (Inf. Variable): 3" - 150" / Min.
Maximum Swivel of Table: 3 Deg. Forward; 11 Degrees Back
Work Head Speeds (Inf. Variable): 25 - 500 RPM
Headstock Center Taper: No. 12 B & S
Head Stock Swivel: 180 Degrees
Footstock Center Taper: No. 10 B & S
Footstock Quill Retraction: 1"
Grinding Wheel Size: 14" x 1-1/2" x 5"
Grinding Wheel Speeds: (3) 1600, 2000 & 2400 RPM
Wheelhead Auto Infeed (Per Table Reversal): 0.0001" - 0.003"
Wheelhead Swivel: 90 Degrees Left or Right
Wheelhead Motor: 5 HP 440V 3/60 1740 RPM
Overall Dimensions (Approx.): 136" L-R x 75" F-B x 65" H
Weight (est.): 9200 Lbs.
Equipped With:
Automatic Plunge Feed / Automatic Pick Feed at Table Reversal
Automatic Lubrication
Dwell Timer (0 - 2.5 Seconds Left & Right)
Headstock Jog Button
Collet Nose in Headstock
Automatic Cycle w/ Spark Timing Arrangement and Wheel Slide Rapid Travel
Selector Switch for: Set-Up/Manual/Auto Cycle
Brown & Sharpe ElectrAlign for Instant Electronic Alignment of Swivel Table
Coolant Pump and Tank
1983 vintage.
BROWN & SHARPE 1440U Wafer Grinding, Lapping, & Polishing Equipment is an advanced system designed to produce the highest quality wafers in minimal time. The machines are designed to provide accurate, repeatable, and consistent sub-micron finish levels while also minimizing wafer breakage. The columns and spindles of 1440U are designed to allow for lapping, grinding, and polishing of the highest quality wafers. The high torque electric servo motors will provide precise control to the spindles and axes to ensure the best possible results. The machine also comes with a high-tech unit to allow for the monitoring of temperatures and force to ensure accuracy and reliability. BROWN & SHARPE 1440U also includes precise counters for both axes to allow for precise and consistent repeatability of each process step. This same machine can be used to adjust the abrasive flow, focus, and feed rate depending on the wafer size and polishing requirement. The machine comes equipped with a range of parametric data storage and retrieval features to allow for throughput optimization. This can help to reduce the grinding cycle time by setting repeatable and consistent setup parameters. The machine also comes with two powerful and flexible grinding wheels, which allow for grinding and polishing of even the most challenging parts. The design of 1440U ensures total safety, utilizing safety sensors and switches that can shut off all machine functions when the door is opened. The machine also has a variety of input/output interfaces to provide trouble-free automation and a computerized remote function that allows operators to monitor production progress in real-time, while still keeping the machines away from operators by enclosing the grinding tool within a cabinet. In conclusion, BROWN & SHARPE 1440U Wafer Grinding, Lapping, & Polishing Asset provides specific, precise, and reliable control, ensuring high quality production performance. The automated model eliminates any operator error, helps reduce downtime, and maximizes output. This equipment provides maximum safety, accuracy, and reliability all in one package.
There are no reviews yet