Used BROWN & SHARPE Etalon derby 454 #9128264 for sale

BROWN & SHARPE Etalon derby 454 is a state-of-the-art wafer grinding, lapping and polishing equipment designed to facilitate the production of high accuracy, precision wafers with the highest level of quality. The system utilizes multiple abrasive lapping plates, each designed to accommodate a variety of wafer sizes and materials. The lapping plates are driven by the unit's vertical variable speed drive machine and individually adjustable to gain proper grinding and polishing results, according to different surface properties and requirements. In addition, the tool is designed to support fine grinding, lapping and polishing of a wide variety of materials from hard metals like steel to brittle materials such as pyrex or glass. This versatility is made possible by the use of an adjustable kinematic drive asset which allows for variable speed and greater control over the material removal rate. The control model offers various parameters, like speed, load, torques and pressure, and each grinding head is equipped with a loadcell measuring device providing further control over the grinding process. The equipment allows to quickly adjust the position of the ground wafers relative to the grinding heads for sensitive process control, with axes adjustment accuracy in the range of 0.005mm. It also features a machine safety switch which automatically deactivates the lapping plates upon contact with the wafer surface to ensure that it will not be damaged. The system has a large selection of abrasive lapping plates with diamond, CBN (cubic boron nitride) or silicon carbide grains available, ensuring accurate grinding results. Specialized lapping plates are available with polishing compounds to achieve a mirror-flat surface finish as per customer requirements. The unit is easy to set-up and use, allowing for efficient and reliable production. A color touchscreen Human Machine Interface (HMI) provides full control of the process, offering feedback from the grinding heads and parameters control for process optimization and monitoring, as well as providing a range of diagnostic tools and data logging capabilities. The machine boasts a range of safety features such as an E-stop button, tool protection shield, tool weight protection and dust protection housing, making it ideal for safe on-site operation. This reliable, comprehensive wafer grinding, lapping and polishing tool is a vital tool for optimum wafer fabrication.