Used BRUDERER BDWP.EC09-800 RKE1 #9052600 for sale

BRUDERER BDWP.EC09-800 RKE1 is an advanced wafer grinding, lapping and polishing equipment. This multi-functional machine is designed for automated production for a wide range of fabrication processes involving wafers used in the semiconductor, LED, and MEMS industries. The RKE1 combines two parallel grinding spindles in order to achieve the machining requirements of each job. The first spindle operates at low-speed and can reach down to 400 rpm. This spindle is used for the initial grinding processes with diamond wheels and grinding pads. The second spindle operates at a higher speed, up to 3500 rpm, and is equipped with a polishing sponge wheel and lapping film discs. This spindle is used for the finer polishing processes that are required for high-quality surface finish. The spindles are reinforced in order to reduce vibration and provide a precise, accurate grinding or polishing action. Each spindle has an independent drive system easing operation and minimizing the wear on the spindle components. This ensures that the unit maintains a precise level of operation throughout the machining cycle. The RKE1 also has a rotary table machine, synchronous-motion drive, and a self-generated grinding force tool. The synchronous-motion drive enables the machine to maintain a steady, uniform grinding or polishing action regardless of wafer or DIW material. The rotary table enables the wafer to rotate at a controlled speed as the grinding or polishing process is underway. This ensures that the results achieved are of a consistent quality. The self-generated grinding force asset ensures that a uniform level of force is applied to the wafer throughout the grinding or polishing process. A built-in cooling model is also featured, which creates a flow of inlet and outlet air to maintain the temperature of the machine during the grinding or polishing process. This helps to protect the wafers and ensures consistent results. An RFID recognition equipment is also incorporated in the BDWP.EC09-800 RKE1, allowing for the efficient tracking and integration of data associated with the machines operations. BRUDERER BDWP.EC09-800 RKE1 is capable of delivering high precision results, making it a perfect solution for automated production of high-quality results in the semiconductor, LED, and MEMS fields. This machine is user-friendly and fully automated, allowing for an efficient and accurate wafer grinding, lapping, and polishing process.