Used BUEHLER 10-1040-460 #9276732 for sale

BUEHLER 10-1040-460 is a wafer grinding, lapping and polishing equipment designed for high precision operation. This system is capable of achieving tight tolerances for wafer thickness, flatness, parallelism, and other geometric features. 10-1040-460 offers high accuracy flatness control and consistent surface quality due to its combination of mechanical and lapping actuators which apply consistent loading and grinding pressure during the entire process. The unit is designed to support a variety of wafers with thicknesses ranging from 0.500mm - 1.500mm. BUEHLER 10-1040-460 includes several components to achieve refined results. A precision spindle holds the wafer on a vacuum pad, maintaining its stability throughout the process. This is a hydrostatic bearing with tilting capabilities, allowing for variable angles and directions of the grinding motion. A three-axis servo motor table is used to control the X-Y-Z motion of the wafer, precisely positioning it for the lapping procedure. A high-speed lapping head with a lambs wool polishing pad follows the X-Y-Z table's motion. 10-1040-460 includes various components to monitor and prevent excessive grinding pressure. A free-floating pressure transducer, for instance, continuously monitors the pressure of the lapping head against the wafer. This provides tighter control of the required surface finish and prevents excessive grinding pressure. Additionally, an opto-electronic displacement sensor and an LCD display monitor also offer precise monitoring of the wafer's position and surface profile. The use of an advanced touchscreen operator interface allows for convenient and highly precise operation. Through the interface, operators can easily define settings such as pressure and speed, as well as monitor the progress of the grinding, lapping, and polishing process. This operator interface streamlines BUEHLER 10-1040-460's operation and controls, ensuring reliability and accuracy of the results. In conclusion, 10-1040-460 is a advanced wafer grinding, lapping and polishing machine equipped with components to ensure precise operation and tight tolerances for wafers. From its precision spindle, servo motor table, lapping head, pressure transducer, and opto-electronic displacement sensor to its advanced operator interface, this tool is designed to provide reliable and accurate results with minimal operator effort.