Used BUEHLER 12-1513 #150117 for sale

BUEHLER 12-1513 Wafer Grinding, Lapping and Polishing Equipment is a stable and reliable system, designed to automate the grinding, lapping and polishing of wafers and substrates. The unit features a rigidly constructed base for vibration free operation, a powerful motor for high throughput, a flexible wheel wheel speed adjustment, and humidity and dust control. The standard grinding setup consists of 6 grinding disks and a coolant machine. The disks are made of diamond-impregnated material which provides superior grinding and lapping performance due to its low abrasion rate and even surface finish. The disks can be used with abrasive slurry to reduce grind time, increase throughput, and maintain tight process control with minimal operator intervention. The lapping process begins with the application of an abrasive slurry to the rotating disks. This provides an even distribution of abrasive grit which polishes the entire surface of the wafer or substrate. This is followed by a cleaning step to ensure a uniform finish. To ensure the highest throughput and quality, 12-1513 wafer grinding, lapping and polishing tool features a dual-position wet/dry swivel for increased productivity. This asset is essential for higher throughput applications and ensures that the part does not move excessively during the lapping process. BUEHLER 12-1513 model ensures a dust-tight and moisture-free working environment by providing an integrated dust collection and air filter. This dust filter also prevents dust particles from entering the equipment and potentially damaging or contaminating the final products. In conclusion, 12-1513 Wafer Grinding, Lapping and Polishing System is a durable, reliable and efficient unit that provides precision grinding, lapping, and polishing of wafers and substrates. This machine is an ideal choice for high throughput applications due to its combination of powerful motor, dual-position wet/dry swivel and integrated dust collection/air filter.