Used BUEHLER 1600-6405 #9112747 for sale

BUEHLER 1600-6405 Wafer Grinding, Lapping & Polishing Equipment is an advanced piece of equipment for precision machining of semiconductor components. This system combines two distinct functions of grinding and lapping into a single unit providing for high-precision machining of substrates with a surface roughness of 0.2µm or lower. This extremely precise unit is made to attain the highest possible uniformity for applications such as semiconductor wafer polishing, micro mold polishing, and precision grinding. This 68in x 68in machine is engineered to provide rapid, accurate, consistent, repeatable polishing and grinding operations. Its closed-loop feedback control tool enables users to set a desired table rotation speed, and has the capacity to maintain a consistent table speed up to 5RPM, which allows for uninterrupted performance with no start/stop times required. 1600-6405 displays accurately and instantly establishes the correct speeds and polishing parameters, while providing the ability to adjust the parameters if desired. In addition to its excellently accurate performance, BUEHLER 1600-6405 also has multiple safety features built in to ensure the safety of its users and components. This asset comes equipped with reliable foot pedals for variable speed control, as well as features such as emergency stops and overload protection. This model is designed to be used by a single user and requires only minimal setup time. 1600-6405 is a fully automated equipment that is ideal for tasks such as wafer grinding, lapping and polishing. This system combines the best of both grinding and lapping into a single-unit making it an excellent choice for accurately finishing complex parts. This unit ensures uniformity on all processed surfaces. It also has a robust design that ensures reliability and increased up-time under continuous operation. With its multiple safety features, easy setup and user-friendly interface, the BUEHLERW BUEHLER 1600-6405 Wafer Grinding, Lapping & Polishing Machine is an excellent choice for efficient and accurate machining of substrates.