Used BUEHLER 39-1470 #9131231 for sale

BUEHLER 39-1470 is a wafer-based grinding, lapping, and polishing equipment designed for precision wafer processing and micromachining applications. It is a compact, versatile system that can be configured to meet specific needs, enabling fast, accurate production and quality assurance. The machine has four interchangeable working stations, capable of grinding, lapping, and polishing on all types of materials, including metals, ceramics, and composites. The design incorporates floating polishing controls to ensure repeatability and optimal process control and includes dedicated wet/dry grinding and polishing supplies and accessories. The machine has full pressure and flow control capability, with adjustable flow and pressure adjustment of up to 20 bars. The unit has a high speed direct drive motor to achieve impressive precision. Vacuum chucks provide excellent part holding while aiding fixturing and chip collection. Individual stationary and rotating parts controlling functions for optimum surface quality can be operated with joystick or on-panel control. The machine operates with 6-20NM torque and 0.1-0.6μm achieving superior radius and grinding/polishing performance. The machine is further equipped with a powerful, intuitive, user-friendly window-based software that allows setup, control, data capture, and analysis of wafers. Data capture capabilities include single and multi-station operation, including both grinding and polishing steps. Taking panel data as input, wafer grinding and polishing cycles can be optimized for time, efficiency, and cost. In addition, the machine includes a wide range of intuitively designed, ergonomic features such as the fully adjustable sample chamber for precise sample positioning, adjustable idling speed, and logical engineering of air and vacuum systems. The machine also has an optional slurry delivery tool to better ensure quality wafer surface finish. Overall, 39-1470 is an incredibly versatile asset that provides the utmost precision and accuracy when it comes to grinding, lapping, and polishing wafers and is suitable for any requirement.