Used BUEHLER 488182 #9096828 for sale

BUEHLER 488182 equipment is designed for wafer edge grinding, lapping and polishing. This system provides a high-precision course finishing and finish polishing surface accuracy on semiconductor wafers. The unit is comprised of an adjustable control platform with manual control handles and an integrated precision gear drive machine. The tool includes a lower arm support to suspend a wafer grinding abrasive disc and pad, allowing for the user to adjust the pressure applied to the wafer just like in traditional hand grinding. The adjustable controller enables the user to dial in the exact speed that is necessary to achieve the desired surface finish, as well as control the flywheel speed. Additionally, the asset also includes a vacuum-gouging and lapping option, allowing users to polish and finish a wafer surface at a lower pressure than traditional grinding techniques. 488182 model utilizes a combination of diamond grinding, lapping and polishing abrasive materials to achieve an optimal surface finish. The diamond abrasive used in this equipment is able to provide a superior surface finish when compared to traditional grinding and polishing techniques. Diamond abrasives make quick work of wafer polishing operations, and the system has the capability to achieve within-spec results, removing burrs, scratches or other surface defects. The lapping process utilizes a suspended spherical-shaped absorbent paper to evenly distribute the abrasive grains, resulting in a more uniform surface finish. BUEHLER 488182 unit utilizes a user-friendly touch panel display to allow for easy operation. On-screen graphics provide the user with clear information about the wafer polishing parameters including abrasive type, disc size, and lapping pressure. In addition, real-time monitoring of the wafer's surface condition is made available for easy interpretation of surface results. The machine additionally includes a lubrication feature for maintaining the precision parts of the tool and ensuring that abrasive particles are prevented from adhering to the wafer surfaces. This feature also reduces the time needed to clean the parts during and after grinding, thus improving the efficiency of the production process. All of these features and capabilities contribute to the superior surface finish capabilities of 488182 asset. By utilizing the model's adjustable controller, the user can easily set the required speed and pressure for achieving wafer polishing results that meet the standards of even the most demanding precision semiconductor processes.