Used BUEHLER 49-3000-160T #9245107 for sale

BUEHLER 49-3000-160T Wafer Grinding, Lapping & Polishing equipment is an ideal solution for graining, lapping, and polishing hard and brittle materials such as ceramic substrates used in the semiconductor, optoelectronic, and microelectronic industries. This system offers high accuracy and repeatability, making it an excellent choice for high precision grinding and polishing. The unit includes an automated, cantilevered single wafer chuck, an integrated chuck and vacuum controller, and a recirculated, sealed water-filled grinding chamber. The chuck has an automated safety check, which ensures proper substrate handling. This machine also uses diamond abrasive pastes to create multi-level, uniform grinding and polishing across the entire wafer. The tool is designed with a variety of features to provide optimal performance and convenience. It includes a dust and scratch-free environment for precise grinding and polishing. It has a low-noise, high power drive motor with a powerful coreless motor to ensure grinding and polishing power up to3000 RPM. The asset utilizes a single touch-screen LCD, which enables easy navigation and control over the model's functions. The control panel is designed to allow for straightforward control of parameters like wafer diameter, on/off control, speed, time, pressure, and temperature. Furthermore, 49-3000-160T has a unique software embedded in the panel, providing a detailed simulation of the grinding and polishing process for easy management. The user is able to check process conditions, monitor the progress of the grinding and polishing session, and display real-time images. BUEHLER 49-3000-160T Wafer Grinding, Lapping & Polishing equipment is an efficient and reliable solution for the semiconductor, optoelectronic and microelectronic industries. Its robust design, reliability, and ease of use make it an ideal choice for achieving high-precision grinding and polishing results.