Used BUEHLER 49-3001-160 #293634194 for sale

BUEHLER 49-3001-160 'wafer grinding, lapping & polishing' equipment is a perfect tool for high-precision wafer preparation. The system consists of two independent, controlled grinding/polishing heads which enables the simultaneous surface processing of two substrates (wafers). The grinding head also contains a viscometer for optimized process control. To guarantee the highest accuracy, the machine has a built-in stiction-free drive for smooth and precise movement of the wafer being prepared. 49-3001-160 wafer preparation unit is capable of preparing wafers with a diameter up to 150 mm, including the use of 6", 8", 12" and other diameters. Three different surface preparations can be applied: grinding, lapping, and polishing. Firstly, using grinding the wafers are automatically deformed and then followed by lapping to finalize the preparation. Lastly, polishing provides the exceptional surface finish required for semiconductor production and research. The machine also includes a built-in computer tool with intuitive user interface and reinforced automation capabilities. The software allows tracking of all asset parameters and provides with instant feedback to process optimization. Moreover, the model can be programmed for operation across a wide range of wafer sizes and geometries. Grinding and polishing times can be determined according to user's desired specifications. In addition to the two working heads, the equipment features a wire-supported loading mechanism designed for maximum precision down to 0.4 microns. The loading mechanism automatically locks the wafer in place for processing, ensuring a consistent and accurate result every time. Furthermore, the system is compatible with different chemical slurries and solutions to allow for fast and precise cleaning of the wafers. BUEHLER 49-3001-160 'wafer grinding, lapping & polishing' unit provides efficient and precise surface preparation of high-quality wafers making it an ideal tool for semiconductor product manufacturing and research.