Used BUEHLER 49-3001-160 #9033158 for sale
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ID: 9033158
Semiautomatic grinder / polisher, 8"
Platten: 1-50rpm
Head oscillation: 22 cycles/min
Digital micrometer
Includes 60-5152 tilt alignment microscope assembly with cross hair alignment
Cat no. 49-3100 integrated circuit cross sectioning system with MPC-2000 power head
60-5153 digital display
2007 vintage.
BUEHLER 49-3001-160 is an advanced wafer grinding, lapping & polishing equipment designed to deliver high-quality results. This system is designed to deliver precision wafer grinding, lapping and polishing, while creating a smooth surface finish. It utilizes advanced grinding, lapping and polishing technology for optimal resuts. The unit features an integrated material handling machine, allowing for full material flow control. The grinding component of the tool is designed with a fixed grinding/polishing pad and adjustable work piece holder. The grinding pad is constructed using a diamond grain matrix and is designed to provide repeatable results for precision grinding, lapping and polishing. The adjustable work piece holder allows operators to adjust the work piece to the optimum position for grinding, lapping and polishing. For lapping and polishing, 49-3001-160 uses a diamond-resin segmented grinding belt which is designed to offer maximum flexibility in order to reach the desired results. Using a wafer-loaded platen asset, the model allows users to set the polishing contour, pressure and abrasive consumption to match the requirements. Additionally, the equipment features automatic pressure control for superior uniformity across the wafer. The system is controlled by an integrated PCS with user-friendly software designed to ensure optimal flow control. The intuitive controls can be used to quickly and precisely adjust the parameters of the grinding, lapping and polishing operations, meaning that the users can quickly and easily achieve the desired surface finish. The unit is also equipped with a range of safety features, such as an emergency stop button, which ensures operator safety. Overall, BUEHLER 49-3001-160 is a powerful wafer grinding, lapping and polishing machine that is designed to provide superior results. It utilizes advanced grinding, lapping and polishing technologies for optimal results, while the material handling tool ensures full control over the material flow. The advanced controls allow users to quickly and precisely adjust the parameters of the asset in order to reach desired outcomes, while the range of safety features ensure operators' safety.
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