Used BUEHLER 49-7251 #9356211 for sale

BUEHLER 49-7251 is a high performance, multi-functional wafer grinding, lapping, and polishing production system. The top of the line components, advanced design and user-friendly operations combine for unparalleled efficiency and accuracy in wafer grinding, lapping and polishing processes. It is designed to polish a wide variety of flat wafers, including semiconductor, silicon, gallium arsenide, piezo-electric, and glass for a variety of markets, including optical, research, development, and manufacturing. The unit features a motorized setup for properly centering and positioning the wafers for grinding, lapping and polishing. An adjustable grinding spindle provides reliable grinding and polishing with the minimum amount of effort. A speeds of 2000 to 4500 RPM can be set for ideal application and results. The velocity sensing mechanism ensures safety and prevents excessive wheel wear, and the water coolant keeps the wheel from becoming overheated during the grinding process. The lapping and polishing operations are handled by the lapping table, which utilizes two lapping plates that move in a precise oscillating manner to produce a smooth, even surface. The lapping pressure, temperature and speed are controlled via a digital display and can be adjusted to suit the particular material being worked on. 49-7251's automated inspection and diagnostics systems provide complete, detailed analysis of the wafers before and after each process. This ensures a uniform surface finish and delivers optimal results. The unit also incorporates a thermal imaging camera to detects surface abnormalities quickly and accurately. BUEHLER 49-7251 is an all-in-one solution for wafer grinding, lapping, and polishing in professional and industrial applications. It's versatile, efficient, and backed by a two-year warranty, making it an invaluable part of any production line.