Used BUEHLER 69-1100 #9148818 for sale

BUEHLER 69-1100 is a complete wafer grinding, lapping, and polishing equipment designed to reduce the time and effort required for processing high volume and/or high-precision wafers. The system is equipped with a custom-designed adjustable headstock, dressing feature, and dual forward/reverse workhead. This powerful and versatile wafer processing unit provides fast, consistent, and repeatable, lapping, polishing, grinding, and finishing of wafers up to 8" in diameter. The machine is powered by a 3 HP, 2 speed drive, and three motors for variable speed control. The dressing feature is adjustable in order to optimize the grinding pressure and polish rate. Internal power supplies are also adjustable, allowing the user to make advantageous changes to the parameters over the course of processing a single wafer or a batch of wafers. The adjustable optical table allows precise alignment to a robotic wafer feeder. The forward/reverse workhead accommodates forward rotational motion for grinding and lapping of wafers, and reverse motion for polishing and fine-grain finishing. The wafer grinding wheel is adjustable for coarse and fine grinding, and the wafer polishing pad is adjustable for various polishing processes. The headstock can be adjusted for various wafer diameters, and the internal variables can be adjusted for specific processes and lot sizes. With the combination of these features, 69-1100 can quickly achieve consistent results for larger volume and high-precision wafer processing. BUEHLER 69-1100 is constructed with a stainless steel enclosure and designed to minimize noise and vibration. The tool is also equipped with several safety features to minimize the risk of mishandling the grinders and polishers, protecting both the workers and the process. The asset can be integrated with chillers, vacuum wafer handling systems, robotic wafer feeders, and various process parameter monitoring and control equipment. 69-1100 Wafer Grinding, Lapping, and Polishing Model is the perfect solution for high volume and/or high-precision wafer processing. This complete equipment is easy to setup and operate, can quickly and consistently achieve the desired results, and is designed for worker safety and reliability. This system uses powerful motors and adjustable variables for maximum control over the entire wafer processing process.