Used BUEHLER Automet 250 #293640954 for sale

ID: 293640954
Grinder / Polisher.
BUEHLER Automet 250 is a high-performance wafer grinding, lapping, and polishing equipment. This system is ideal for preparing wafer surfaces for microelectronic, optoelectronic, data storage, and MEMS device manufacturing applications. Automet 250 features a compact design that reduces floor space requirements and an easy-to-use touch screen interface that provides user-friendly operation. BUEHLER Automet 250 automates the grinding, lapping, and polishing processes of wafer surfaces with reliable repeatability and accuracy. Its computer-controlled platen increases grinding speeds and provides abrasive gapping. Its two-stage diamond grinding process uses adaptive control to precisely regulate the grinding rate and deliver the desired surface finish. Automet 250 is highly versatile and can accommodate a wide range of abrasive materials including diamond, silicon carbide, and alumina, among others. The unit also allows users to easily adjust the pressure, speed, and direction of the grinding, lapping, and polishing operation to generate the desired surface finish. This ensures that the device can work with almost all types of semiconductor wafers. BUEHLER Automet 250 is constructed from robust materials for long service life and reliable performance. Its components are also made for easy access and include an adjustable pump with flow rate control, and a particle filter to ensure clean process water. The machine also offers a wide range of safety features such as an emergency stop button and safety interlocks for maximum protection. In addition, the tool can be equipped with a range of accessories such as wafer handling systems and automated wafer polishers to optimize wafer production. Automet 250 is an excellent choice for preparing wafer surfaces with precise grinding, lapping and polishing performance that is fast and precise. This asset delivers consistently precise results, making it ideal for device manufacturing applications that require robust and efficient surface preparation.
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