Used BUEHLER Automet #9033605 for sale

BUEHLER Automet Grinding, Lapping & Polishing Equipment is a professionally designed sophisticated machine used in the precision grinding and polishing of thin wafers. It is equipped with a diamond abrasive grinding wheel for rapid and efficient material removal, capable of grinding layers just a few microns thick. The grinding wheel is capable of extending and retracting for easy removal of the wafer. The lapping and polishing capabilities of Automet are largely unmatched. The system comes with an advanced diamond-impregnated disc lapping plate, which allows for incredible precision polishing of the wafer surface with minimal effort. The capacity of this machine is large enough to handle multiple wafers at once, saving time in the production process. BUEHLER Automet is also equipped with an advanced vibration-free slurry delivery unit for uniform application of the abrasive. This machine has been designed to keep all slurry and waste within the tool and eliminates the need for any elaborate cleaning procedures. It is also engineered with a special process control asset, enabling precise control over grinding, lapping and polishing sessions and accurate results. Automet is one of the few machines of its kind capable of grinding and polishing on both sides of the wafer at the same time. It is equipped with two separate grinding and polishing heads, eliminating the need to stop the machine and manually flip the wafer. The heads also offer adjustable speeds for precise and reliable control over the process. BUEHLER Automet is designed to meet the strict requirements of many industries such as semiconductor, microelectronics, data storage, optical, and much more. The combination of all its features and advanced technology make it one of the most reliable and powerful grinding, lapping and polishing systems in the market today.