Used BUEHLER DUOMET II #9020604 for sale

BUEHLER DUOMET II is a wafer grinding, lapping and polishing equipment designed for high-precision processing of semiconductor and optical materials. The system features a robust, yet compact design capable of processing chips up to 12" in diameter. DUOMET II utilizes a flexible platform for grinding, lapping and polishing wafers. The unit can be configured with up to three grinding wheels, which can be indexed to minimize variations in wafer size and surface finish. The machine has a dedicated lapping/polishing wheel station which can be set to accommodate a broad range of lapping and polishing abrasive size and speeds. The lapping wheel is also designed with a adjustable flow cooling nozzle for more precise thermal control. The tool is designed with a variable speed drive, with speeds ranging from 0-1500 RPM, and a high torque clutch that allows quickly changing of process speed settings. The drive asset is connected to a spindle unit that stops during emergency situations to prevent damage to the material. The precise, vacuum chuck holds the sample securely in place during the process, while also allowing a quick change of wafers without the need for tooling. The integrated, human machine interface (HMI) allows for easy programming of the process parameters including speed, angle, steps, and grinding area. The HMI also allows for manual control of the model, as well as diagnostics of the process for quick troubleshooting and process optimization. BUEHLER DUOMET II is designed to meet the highest industry standards and provide a long service life. The robust construction, quality components, low vibration operation, and advanced controls make this equipment ideal for use in a variety of semiconductor and optical production processes. By providing reliable operation and repeatable results, DUOMET II is a powerful and cost effective solution for wafer grinding, lapping and polishing.