Used BUEHLER DUOMET II #9020605 for sale

BUEHLER DUOMET II is a multi-purpose wafer grinding, lapping and polishing equipment. Used for both coarse and fine machining of soft to hard materials, DUOMET II allows precision grinding, lapping and polishing of wafers up to 300mm in diameter. The machine consists of a rotating base plate utilizing an orbital motion, which is designed to support components with different sizes and shapes. The base plate is mounted on a series of vibration-dampening supports, allowing it to be operated in any of several positions. A range of abrasive belts, paper rolls and diamond plates can be applied to the base plate to provide various levels of grinding, lapping and polishing. BUEHLER DUOMET II is equipped with an integrated vacuum system that ensures dust-free grinding, lapping and polishing operations. The vacuum can be adjusted depending on the material being worked on, as well as the grinding, lapping or polishing level required. Additionally, it has a unique exhaust fan which helps to maintain a dust-free environment during operation. The unit also includes an adjustable speed motor that allows for full control over the grinding, lapping and polishing processes. Speed range is between 4,000 and 8,000 revolutions per minute, with a maximum loading capacity of up to 180 g-force. DUOMET II comes with a range of accessories designed to provide a wide range of grinding, lapping and polishing operations. These include different sizes and grades of diamond plates, abrasive belts, grinding wheels, and various polishing pads and materials. Additionally, it has a reliable clamping machine that securely holds wafer samples in place. In conclusion, BUEHLER DUOMET II is a highly versatile and robust wafer grinding, lapping and polishing tool. Its integral dust-free vacuum asset and adjustable speed motor make it perfect for a wide variety of grinding, lapping and polishing applications. With its range of accessories it can handle everything from coarse to fine grinding, lapping and polishing operations, ensuring superior results in less time.