Used BUEHLER DUOMET #9020440 for sale

BUEHLER DUOMET is a cutting-edge wafer grinding, lapping and polishing machine designed for use in semiconductor and flat panel industries. DUOMET is engineered to provide perfect flatness and parallelism of up to .6 microns in addition to a surface roughness of up to 4.5 nm Rms. BUEHLER DUOMET incorporates a modular design, allowing for quick integration with a wide variety of automation solutions. Additionally, DUOMET includes cutting-edge sensor technology to ensure precise positioning of the lapping and polishing heads. BUEHLER DUOMET operates by removing surface and subsurface defects through the processes of grinding, lapping and polishing. State-of-the-art abrasive technology is utilized to obtain the high precision required for semiconductor grade wafers. DUOMET features a 3-head configuration of lapping and polishing heads powered by different speed motors. These speed motors ensure that a wide array of lapping and polishing processes can be performed. Additionally, a batch option is available for repeatable and continuous operations—enabling users to process multiple samples in a single run. In addition to its advanced lapping and polishing capabilities, BUEHLER DUOMET is also equipped with many user-friendly features. The user interfaces are designed for intuitive operation and feature a graphical display for ease of use. DUOMET's large 4.7 inch touchscreen display makes it easy to program sequences for precise processing. BUEHLER DUOMET also features a variety of embedded process monitoring tools that ensure optimal cycle accuracy and repeatability. Moreover, DUOMET can be tailored to the individual needs of each customer. Optional features are available such as an atmosphere-controlled chamber, a high-vacuum system, and cooling water control. This allows for the construction of a custom-tailored instrument that is specifically designed to meet the needs of each user. BUEHLER DUOMET can be integrated with a host of automation systems for unparalleled production reliability--maximizing process efficiency and minimizing cycle times. DUOMET is the ideal solution for precision wafer grinding, lapping and polishing. Its advanced technology, flexible design, intuitive user interface and automated features ensure precision and repeatable results for the most demanding processing applications. BUEHLER DUOMET is the perfect tool for completing complex grinding, lapping and polishing operations with unparalleled speed, accuracy and reliability.