Used BUEHLER ECOMET 250 #9265633 for sale

BUEHLER ECOMET 250 is a single-head wafer grinding, lapping and polishing equipment designed for wet processing of semiconductor wafers and other substrates up to eight inches in diameter. This highly precise, high-performance system is equipped with an advanced, variable-speed spindle and digital controllers to ensure the best grinding, lapping and polishing results. The all-in-one design allows for simultaneous grinding, lapping and polishing of multiple wafers. ECOMET 250's spindle is powered by a three-phase, air-cooled motor that provides up to 5.3 horsepower. The variable-speed spindle can achieve speeds up to 13,500 revolutions per minute (RPMs). This combination of power and precision allows the user to perform a wide variety of wet processing applications. BUEHLER ECOMET 250 also features a control panel for easy setup and operation. It includes a 7-inch color touch screen for easy monitoring of the unit's status and a user-friendly graphical interface for intuitive operation. The machine is also designed with safety features such as a light curtain and key-operated switch for preventing user injury and protecting the tool against accidental damage. ECOMET 250 is constructed from durable components and materials to ensure reliable operation and easy installation. It also has an integrated coolant asset for efficient heat transfer. All components are electromagnetically shielded for safe, noise-free operation. BUEHLER ECOMET 250 is a versatile and reliable wet-processing model, providing consistent results for a wide range of applications. With its powerful spindle, precise digital control and integrated safety features, ECOMET 250 is an ideal choice for grinding, lapping and polishing wafers and other substrates.