Used BUEHLER Ecomet 3 #9352405 for sale

BUEHLER Ecomet 3 is an automated wafer grinding, lapping, and polishing equipment specifically designed for processing die and wafer materials. The system features separate workstations for three levels of finishing: coarse grinding, grinding lapping, and diamond polishing. It is suitable for a variety of applications including defect evaluation, crystal structure analysis, and the generation of flat surfaces. BUEHLER ECOMET-3 is designed to accommodate up to eight wafers at a time and is equipped with an automated carrier to index them into the grinding station. Its two separate grinding wheels can run at different speeds up to a maximum of 1000 rpm. The grinding cycle utilizes a single abrasive disc, or two abrasive discs to obtain a specific coefficient of friction. Its lapping station is equipped with a special planetary drive for uniform and smooth movement along the surface to help eliminate surface defects and improve finish quality. The polishing station is capable of achieving high-precision results, with the ability to apply variable diamond slurry application rates and slurry adjustment of the polishing rate. The hardware is supported by a CAMS Profile software package that allows the user to quickly and easily set customized material type and treatment parameters. The unit is also equipped with an automatic temperature feedback loop, ensuring that the workpieces remain at the specified temperature as they enter the station. Additionally, Ecomet 3's control machine provides on-demand data logging and trending. ECOMET-3 is CE certified and comes with a variety of options and service programs including automatic cleaning, wafer carrier loading, and general maintenance. It has the versatility to accommodate a wide range of materials and to work under different environmental conditions. Altogether, BUEHLER Ecomet 3 offers an economical, precision-controlled, and automated solution for the processing of wafers, die, and other substrates.