Used BUEHLER Ecomet 3000 #293630180 for sale

BUEHLER Ecomet 3000 is a wafer grinding, lapping, and polishing equipment designed to produce planarization and precision flatness for a wide range of substrates. It has the ability to grind and lap highly complex hardened metal surfaces with a combination of power and fineness that can be tailored for the most challenging applications. Ecomet 3000 also has precision microlapping capability for postgrind / lap processes. This precision polishing machine is an essential system for the production and maintenance of wafers from a wide variety of materials. It is equipped with a high-precision surface grinding spindle and is driven by a closed-loop motor-driven servo unit. This machine enables high-speed and high-precision grinding and lapping operations which are adjustable and repeatable between the boundaries of high surface finish and low thickness variation. BUEHLER Ecomet 3000 also can be used for a variety of materials including SiC, Si, GaAs, and others. The tool is equipped with an integrated control asset and a number of options that can be used to increase accuracy and speed. The integration of a CCD camera with a SmartView imaging model provides the user with the ability to control and inspect the grinding and polishing process in real-time. This equipment helps ensure that consistently high-quality surfaces can be produced or maintained. Ecomet 3000 is a high-precision system that can provide consistent planarization and flatness across the widest range of materials, even the most difficult to work with. It has a comprehensive library of grinding and lapping parameters, allowing users to fine-tune the process to the specific requirements of their applications. The features of this unit, including integrated control, imaging, temperature control, closed-loop feedback control, and easy-to-operate software, combine to make it an ideal machine for wafer grinding, lapping, and polishing.