Used BUEHLER ECOMET 4 #9294141 for sale

BUEHLER ECOMET 4 is a wafer grinding, lapping, and polishing equipment specifically designed for semiconductor and related materials used in the circuitry of integrated circuits (ICs). This multi-functional system is ideal for producing smooth, precision-ground, and lapped surfaces in a wide variety of materials, such as sapphire, aluminium nitride, germanium, diamond, and silicon. The unit enables wafers of varying thicknesses and sizes, from 200 mm to 12 in (300 mm), to be processed in one setup, eliminating the need to change platens manually when working with different wafer sizes. The machine is equipped with two platens that move independently of each other, allowing precise control over the grinding, lapping, and polishing processes. The combination of a platen rotation motor and tooling arbor ensure the highest level of precision during these processes. The platens are also optimized for high-velocity grinding, lapping, and polishing, with a maximum rotation speed of 600 RPM. In addition to precision grinding and lapping, ECOMET 4 tool offers several advanced polishing capabilities, including rotary, orbital, and linear polishing. All polishing processes are designed to produce a polishing uniformity of up to 2nm. The asset is additionally equipped with a high-precision linear feed, providing precise control over sample positioning. For convenience, BUEHLER ECOMET 4 wafer grinding, lapping, and polishing model includes a wide range of interchangeable platens, tooling arbors, polishing pads, and accessories. The equipment also includes several user-friendly features, such as an intuitive graphical user interface, precision grinding table, and remote data logging. This allows operators to quickly and easily monitor, program, and review process parameters. ECOMET 4 system is a reliable and versatile wafer grinding, lapping, and polishing unit, making it the ideal choice for demanding and high-volume materials processing applications.