Used BUEHLER ECOMET III #201207 for sale

BUEHLER ECOMET III is a fully automated, compact precision polishing, lapping, and grinding equipment for thin wafers. This system utilizes a unique, patented, dual-belt technology for material rapid removal, offering improved reproducibility and surface finish consistency. ECOMET III features a cast aluminum machine base and a fully enclosed working chamber designed to provide a clean, safe, and reliable operating environment. Its unique dual-belt technology allows for continuous control of the belt speed, resulting in rapid material removal rates combined with superior surface finish. It also features a wide variety of lapping and polishing applications, allowing it to process substrates such as single-side polished wafers, backgrinding wafers, and thick wafers up to 25 mm. BUEHLER ECOMET III is user friendly and is designed to reduce process setup time with intuitive controls and minimal maintenance requirements. This unit is capable of controlling up to four processing parameters which include belt speed, plunge pressure, load pressure, and coolant temperature. It offers a wide range of process parameters to ensure optimal surface finishing for every application and substrate. All process parameters are easily adjustable and customizable so the user can optimally configure the machine to their desired requirements. ECOMET III is equipped with a self-diagnostic tool to monitor asset performance and alert the user of any faults or errors. It also includes a model watchdog, which will automatically shut down the equipment in case of any abnormal activity or error. Additionally, BUEHLER ECOMET III is compliant with international safety standards, providing a safe and reliable working environment. In conclusion, ECOMET III offers superior performance, reliability and efficiency for wafer grinding, lapping and polishing applications. Its intuitive and user friendly design combined with its state of the art dual-belt technology provides improved surface finish consistency as well as rapid material removal rates. Furthermore, its self-diagnostic functionality ensures optimal performance and safe operation, making BUEHLER ECOMET III the ideal choice for wafer processing needs.