Used BUEHLER ECOMET III #74995 for sale

BUEHLER ECOMET III is a versatile wafer grinding, lapping, and polishing equipment designed to process a variety of semiconductor and microelectronic devices. The system offers high precision, high speed grinding and polishing capabilities, allowing users to achieve superior surface quality and device fabrication cycle times. The unit's advanced design features a rigid aluminum frame that is designed for vibration-free operation and a choice of CNC or PLC control systems, which support fully-automated processing. The high speed, low-pressure lapping machine uses special diamond powders to provide repeatable and controllable results. The tool can process up to 12 wafers simultaneously with multi-slot capability. ECOMET III is designed for precise and consistent operation, even at high speeds. Its variable speed drives and precise torque control enables users to achieve a high-quality output. The machine's variable-speed drive asset allows for the precise control of speed across multi-axis operations, with an accuracy of +/- 0.01 rpm. The model also includes a programmable lift/load arm and automated interface with robotics, allowing for accurate and consistent loading/unloading of wafers. The built-in safety equipment provides personal protection with audible and visible alarms, automatic shutoff, and emergency shutoff functionality. This wafer grinding and lapping system can process a variety of materials, including silicon, sapphire, germanium, ferrite, and glass. Additionally, the unit supports multiple grinding, lapping, and polishing processes such as single and double-sided, simultaneous and sequential, specific area, and flat and uneven polishing. The machine offers users the ability to produce consistently flat, smooth, and scratch-free surfaces for various kinds of micro and nano fabrication processes. In addition, BUEHLER ECOMET III offers advanced options such as automatic dress and in-process corrections and grinding quality inspection, allowing users to optimize their production process. Furthermore, high-efficiency chiller systems are available for temperature-controlled operation for higher-quality polishing results. In summary, ECOMET III is a powerful and versatile wafer grinding, lapping and polishing tool designed to meet the highest standards of precision, accuracy, and performance. With its advanced design and powerful control systems, this asset offers users an effective and efficient solution for processing a variety of materials.