Used BUEHLER ECOMET III #9013330 for sale

BUEHLER ECOMET III
ID: 9013330
Variable speed grinder / polisher Model no 49-1750-160.
BUEHLER Ecomet III is a versatile and technologically advanced grinding, lapping and polishing equipment. Featuring a powerful 0.4kW motor, it operates at high speeds for rapid stock removal and surface finish improvement. Ecomet III can be used for various grinding and polishing processes such as wafer slicing and lapping, planar grinding, buffing and micro polishing. The system's tooling easily adapts to the customer's desired work zone range and grinding parameters. The unit provides a high level of accuracy and repeatability, with a very low vibration that enables the operator to work with a wide range of materials including silicon, gallium arsenide, and quartz. The dynamic working surface balance facilitates precision adjustment of the grinding and polishing performance. The 3-axis linear motion machine allows for simple, precise and adjustable speed and direction control. The drive tool and digital control asset enable the operator to accurately and repetitively adjust the speed and torque for increased productivity. The efficient design of BUEHLER Ecomet III reduces the risk of poor quality parts and yield losses. An automatic correction model ensures that any tool, material or parametric variation are immediately corrected before the process begins, guaranteeing the best part consistency. Additionally, the low-vibration design enables the equipment to be used in cleanroom conditions, meeting the industry's most stringent standards. Ecomet III also offers advanced online system diagnostics with real-time tracking of all vital process parameters. The unit logs all data for easy comparative analysis and process optimization. A full range of user-replaceable components ensures consistent performance, while an integrated alarms and error diagnostics machine ensures maximum uptime. The advanced features of BUEHLER Ecomet III make it one of the most advanced grinding and polishing systems available today. It is an ideal solution for wafer slicing, lapping and polishing, providing superior results in reduced time and improved safety.
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