Used BUEHLER ECOMET III #9033156 for sale

BUEHLER ECOMET III is an automated wafer grinding, lapping and polishing equipment designed specifically for use in semiconductor wafer production. This advanced system is capable of grinding, lapping and polishing a variety of different semiconductor materials, such as Silicon, GaAs, Sapphire, Quartz, and many more. ECOMET III utilizes precision planetary abrasive polishing plates to provide superior finish on the wafer surface and superior accuracy in wafer thickness and dimension. BUEHLER ECOMET III is powered by an accurate external Siemens servo motor which provides precise speed and pressure control while lapping and polishing. This ensures high-quality surface finish for each processed wafer. ECOMET III is equipped with a unique, adjustable Pressure Cell that can be adjusted for a custom finish on each wafer. BUEHLER ECOMET III also incorporates a temperature controlled chuck which ensures optimal lapping and polishing results. ECOMET III is designed to provide consistent throughput and quality results with minimal operator attention. This is achieved through built-in features such as automated indexing for repeatable wafer loading, as well as the ability to save many process recipe settings. BUEHLER ECOMET III also features a choice of two different grinding wheels (diamond or non-diamond abrasive) to suit the specific application requirements. ECOMET III is also designed for easy maintenance and servicing. The unit includes a spindle maintenance machine, allowing quick and easy maintenance of the planetary abrasive platens. BUEHLER ECOMET III also features an automatic grinding media replenishment tool which helps to ensure that the asset is consistently generating a uniform finish to the wafer. Overall, ECOMET III is a highly reliable and versatile wafer grinding, lapping and polishing model which offers superior finish and accuracy to increase productivity in the semiconductor industry. The equipment is easy to use, has a small footprint, and can easily be customized for specific application requirements.