Used BUEHLER ECOMET III #9047524 for sale

BUEHLER ECOMET III is a high-performance wafer grinding, lapping and polishing machine. It is specifically designed for high-precision applications and features an integrated three-axis drive equipment that enables precise and repeatable grinding operations in both flat and curved surfaces. The machine is capable of grinding, lapping and polishing wafers and substrates up to 4" (100 mm) in diameter. ECOMET III is equipped with a reliable, powerful single-phase motor that provides user-adjustable speeds ranging from 0 to 20,000 RPM. It also features an integrated air bearing system to reduce vibration and improve grind quality. The motor is equipped with a digital encoder that provides precise control and allows for repeatable speed settings. It has a variety of accessories and attachments to improve the grinding process, including a variety of diamond points, felt buffs, and specialty pads. BUEHLER ECOMET III incorporates a special controller that uses digital memory to store process parameters. This advanced technology allows the machine to recall multiple settings, including speed, direction, and load. It also allows the user to use multiple grinding speeds in the same process. To ensure accuracy and repeatability, the machine includes a digital dial indicator that allows precise measurement to an accuracy of 0.001 mm. This allows for precise control over the processes and ensures that the results are repeatable. ECOMET III has a two-stage cooling unit with a large fan and HEPA filter to reduce dust and create a clean environment. This machine also helps reduce motor wear and extends the life of the machine. Additionally, the machine is made of stainless steel and features a heavy-duty frame that provides maximum stability during operation. BUEHLER ECOMET III has been designed for industrial and laboratory applications that require high-precision grinding, lapping, and polishing. Its advanced features and user-friendly design make it a great choice for high-quality, precision operations.