Used BUEHLER ECOMET III #9133292 for sale

BUEHLER ECOMET III is an advanced wafer grinding, lapping and polishing equipment. This system is designed to deliver high-precision results for single wafer grinding, lapping and polishing operations. It offers outstanding accuracy, repeatability and surface finish control, for greater process control and higher yield. This multi-purpose unit combines both a fully automated 6-axis robot and a precision linear motor stage. The 6-axis robot offers a wide range of motion that includes two axes for transverse motion, two axes for angular motion, and two axes for linear motion. The precision linear motor stage provides a high performance working platform with a high degree of accuracy and repeatability, enabling flexibility for single-wafer or multi-wafer applications. The machine is also equipped with ECOMET III software package. This software provides a range of advanced features, including an intuitive user interface, interactive planning tools, process control features, and math functions for tracking process performance. The software also includes an integrated, secure data management tool. BUEHLER ECOMET III is suitable for various applications including; thin film deposition, passivation, dicing, and back-grinding. In addition, it can be used for patterning, device isolation, thinning and metrology. The asset also offers superior quality results, with reliable repeatability. It is also designed for easy maintenance and operation, with an integrated safety model. Furthermore, the equipment includes a variety of control options, such as automatic level control, remote monitoring, and feedback for every axis. Furthermore, it includes a set of dedicated tooling adapters and sample holders for greater flexibility. Finally, ECOMET III is also ISO 9001 certified, ensuring the highest quality standards and processes. All the components are made from high-quality materials and adhere to industry standards. Furthermore, the system has been extensively tested to ensure reliable operation in demanding wafer processing environments.