Used BUEHLER ECOMET III #9162398 for sale

BUEHLER ECOMET III is a wafer grinding, lapping and polishing equipment that offers an efficient and cost-effective solution for small- to medium-scale production applications. This system has been designed for use in semiconductor, materials, optics and other related industries, designed for high-quality results with exceptional performance. The unit is constructed with a cast aluminum frame, offering maximum stability and steadiness, ensuring reliable operation and a high-precision finish. The grinding, lapping and polishing functions are aligned and integrated in one module, which can be made of solid or composite parts according to the customer's needs. The machine consists of four parts including ECOMET III Grinder, BUEHLER ECOMET III Lapper, ECOMET III Polisher and BUEHLER ECOMET III Loader. The Grinder is capable of grinding up to 8-inch/200mm diameter wafers. It is powered by a 0.25HP servomotor and an integrated fluid power circuit for variable speed operation of grinding tools. The Lapper is designed for wafer sizes up to 5-inch/125mm and uses variable speed technology to attain superior polishing results. It is driven by a 0.125HP servomotor and is equipped with a triple-segmented, precision lap. The Polisher is designed for 1-4 inch/25-100mm wafers, and is powered by a 0.20 HP servomotor with a speed range from 5-50 RPM. The chucking mechanism consist of a cup chuck and airscreen chuck. The Loader automates the wafer-handling process and is controlled by an independent controller with up to three programmable jobs. In conclusion, ECOMET III is an efficient and cost-effective tool for grinding, lapping and polishing semiconductor and other materials. The asset has been designed for precise, high-quality results and improved productivity. It is constructed with a robust and lightweight frame, and ensures reliable and precise operation through its servomotor technology.