Used BUEHLER ECOMET V #9032870 for sale

BUEHLER ECOMET V is an advanced wafer grinding, lapping & polishing equipment designed for the production and manufacturing of ultra-precision semiconductor wafers. It utilizes proprietary abrasion and polishing techniques to meet exacting requirements for flatness, form accuracy, and surface finish. At the heart of the system is an advanced HTC diamond grinding unit. A dual-head lubrication machine ensures proper coolant distribution during grinding, while the adjustable wheel cartridge allows for fine-tuning of abrasive grain selection for different surface finishes. The tool also uses an array of positioners to position the substrates relative to an electrode and brush-heads, allowing precise control of the grinding process. For lapping & polishing, ECOMET V utilizes a multi-axis motion platform that incorporates a vertical, horizontal, and circularly oscillating lapping & polishing heads. A real-time process monitoring asset provides feedback on the actual parameters, allowing for adjustment of the grinder and lapper. The model then utilizes a multi-stage polishing technique to achieve the desired surface finish. The first stage is the launch pad, where lapped surfaces are prepared for polishing. The second stage uses diamond abrasive polishing pads, and the third and final stage is equipped with a range of processing solutions, including chemical--mechanical polishing (CMP) to further refine the surface finish. BUEHLER ECOMET V includes a full line of software and miscellaneous accessories for integrating the equipment with other manufacturing processes. An integrated video monitoring system allows for viewing of the grinding, lapping, and polishing processes, and a data acquisition unit provides detailed data logging. ECOMET V features a comprehensive suite of safety features, and is certified to meet all local safety regulations. With its advanced grinding and polishing techniques, BUEHLER ECOMET V provides a reliable and cost effective solution for producing ultra-precision wafer components.