Used BUEHLER ECOMET VI #9033550 for sale

BUEHLER ECOMET VI is a powerful, high-performance wafer grinding, lapping and polishing equipment designed for precision in challenging materials. It features a compact design coupled with the latest advances in wafer grinding, lapping and polishing technology. ECOMET VI is designed for high performance operation with superior quality, efficiency, and accuracy. It is also engineered for ease of use, with intuitive touch screen controls and advanced automation features. BUEHLER ECOMET VI features an advanced wafer grinding system that provides high precision grinding with tight tolerances. The unit is capable of grinding wafers from 0.2 to 12 mils (0.5 - 30.5 microns) thick, with a maximum grindable wafer size of 11.8 inches (300mm). The machine utilizes a high torque direct-drive motor to provide smooth and consistent grinding performance. The spindle speed is adjustable from 0-2000 RPM, with a maximum grinding force of 9.9 lbf (44N). The tool also offers a lapping and polishing process for higher quality surface finishes. The open-air lapping table offers an adjustable speed range of 10 to 70 RPM, with a minimum lapping force of 1 lbf (4.4N). The polishing platen utilizes a two-speed motor and adjustable cam to provide consistent polishing performance over a wide range of pressure. The polishing force is adjustable from 6 to 18 lbf (26.2-80.2N). ECOMET VI is designed for ease of use, with its intuitive touch screen control panel featuring a selection of user-friendly menus and automated processes. The asset also showcases advanced automation features, including wafer lift/load, automated wafer transportation, and motion control during grinding, lapping and polishing. The model also offers an optional vacuum transport robotic arm for improved performance and safety. BUEHLER ECOMET VI provides exceptional flexibility for a variety of wafer processing requirements. Its robust design and advanced technology make it a reliable choice for precision wafer grinding, lapping and polishing, and its advanced automation features offer improved performance and increased safety.