Used BUEHLER Ecomet #293759606 for sale

BUEHLER ECOMET is an innovative wafer grinding, lapping and polishing equipment that offers a wide range of advanced features and capabilities. ECOMET is designed for precision, fine grinding of semiconductor wafers (thick and thin layers) using a 450 mm (18") wheel. The wheel can be moved in and out in the x-direction, permitting greater or lesser areas to be machined. The wheel can also be moved up and down in the z-direction, allowing for precise depth control. BUEHLER ECOMET also features a low-frequency air spindle system, which is designed to minimize vibration and generate higher torque than conventional spindle systems. This allows the motor to be cooled more efficiently, while producing smoother surface finishes. A precision feed-through unit enables fast grinding speeds, and the machine is equipped with a complete range of standard features, such as auto-measurement of wheel wear and measurement of automatic wheel radius compensation. ECOMET also features coolant systems for lubrication, coolant selection, and filtering to ensure efficiency and quality of the machining process. The modular design of the machine allows for compatibility with a wide range of grinding wheels and accessories, as well as a choice of manual or automated grinding modes. A unique pressure mode tool is also featured, allowing for optimal pressure output over a broad pressure range. BUEHLER ECOMET is a reliable and durable grinding machine that is highly suitable for the precision grinding of semiconductor wafers. Its modular design, sophisticated control systems and low-frequency air spindle asset provide users with accurate and consistently high-quality finishes. This makes it a great choice for commercial and industrial applications, such as precision engineering and product fabrication.