Used BUEHLER Ecomet #9214533 for sale

BUEHLER Ecomet
ID: 9214533
Polisher.
BUEHLER Ecomet is a wafer grinding, lapping, and polishing equipment designed to provide the highest level of precision and accuracy when producing extremely thin and delicate commercial materials. The system uses a rotating diamond-cut wheel to grind and/or lap the wafer to achieve a flat surface, followed by a polishing wheel to achieve the desired level of smoothness and clarity. The unit is constructed with high-end quality components to endure the demanding grinding and polishing process. The drive is powerful yet efficient, featuring a tuned servo motor that can control either high-speed grinding, lapping, or polishing operations. This motor is connected to the diamond-cut wheel, which sits in a housing capable of handling all grinding and lapping needs. The diamond-cut wheel is diamond-coated surface technology, and is designed to provide a hard-wearing, reliable, and consistent working surface in the grinding and lapping operations. This diamond-coated steel wheel is available in a variety of sizes and cuts for maximum flexibility. The diamond-cut wheel is able to make precision angles as small as 0.002 inches. The polishing wheel also features an impressive level of precision. The wheel is constructed with high-quality ingredients, and features a specialized, soft, porous material to provide a consistent level of polish with minimal effort. The polishing wheel is adjustable in size and hardness, and comes in two different types of compounds for best results. In order to ensure the longevity of Ecomet, in addition to the high-quality components, several additional features have been added. For instance, the machine's dual grindstone/polishing heads can rapidly switch between tasks, allowing for maximum efficiency and accuracy. The adjustable feed and speed of the motor allow for fine tuning of the desired results. BUEHLER Ecomet is specifically designed for the production of extremely thin and delicate commercial materials, such as semiconductor wafers. The tool is also simple to use, requiring little maintenance or setup. Thanks to its high level of precision and its cost-effective design, Ecomet is the ideal grinding, lapping, and polishing solution for this specific application.
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