Used BUEHLER FibrMet #179128 for sale

BUEHLER FibrMet is a high-precision grinding, lapping and polishing equipment designed to produce flawless surfaces on a wide range of materials, such as ceramics, composites, plastics and metals. FibrMet utilizes the latest in abrasive technology to create superior surface finishes with unrivaled accuracy and repeatability. It is a cost-effective solution for many industrial processes and can be used for a variety of applications, such as wafer planarization, bonding sputter coatings and finishing micro-optic components. BUEHLER FibrMet utilizes a proprietary grinding module to achieve superior surface finishes and consistent results. The grinding module is equipped with a diamond grinding belt and a high-precision flat belt feed system, which enable it to grind accurately and quickly. This unit also comes with a variable speed control, allowing you to adjust the speed and pressure for optimal grinding performance. Additionally, the machine comes with a variable speed lapping module, which can be fitted with a variety of abrasives to quickly and accurately polish and smooth surfaces. The variable speed motor allows you to adjust the speed, pressure, and pressure distribution over the workpiece as needed. The lapping module also features a heated platen to control the temperature and a centralised cooling tool to improve finish quality and reduce downtime. Finally, the asset includes a polishing module with an adjustable speed and a range of abrasives for achieving consistent, high-quality finishes. This module is also equipped with a heated platen to control temperature, a dust collection model to prevent debris accumulation, and a fast-acting diamond polishing disc for cleaning and texturing. All components of FibrMet are integrated and designed to ensure maximum accuracy, repeatability and cost effectiveness. BUEHLER FibrMet equipment is the ideal choice for a wide range of grinding, lapping, and polishing applications. It can deliver outstanding accuracy, repeatability, and cost effectiveness while achieving superior surface finishes. With its wide range of features and customizable speed, this system is designed to make wafer grinding, lapping, and polishing easier and more efficient than ever before.