Used BUEHLER FibrMet #293609551 for sale

BUEHLER FibrMet is an advanced precision equipment for grinding, lapping and polishing of wafers. This system is specifically designed to enable rapid processing of semiconductor wafers with very high precision and accuracy. The unit is equipped with the latest grinding wheel and applique to achieve optimum surface finish on ultra-thin ("ultralow-K") wafer layers. It also features built-in multiple cameras and optical probes that allow for real-time inspection during the processing. FibrMet is capable of producing finely detailed surface finish with minimal surface defects and scratches. This is achieved through a high-speed grinding spur along with a proprietary rotating abrasive disc, which is designed to provide excellent material removal without producing visible surface scratches, contaminations or deep machining lines. The disc is highly efficient and produces high-level surface finish even at high grinding speeds. In addition, BUEHLER FibrMet is capable of performing fast and precise polishing of wafers, which is achieved through a combination of a precision polishing wheel, polishing cloth and a proprietary polishing liquid. The machine also has a fast, accurate lapping station that can be adjusted to provide a fine, uniform surface finish as required. FibrMet is also equipped with a range of advanced process monitoring and control systems. This includes real-time 3D imaging capabilities along with integrated metrology tools, which allow for highly accurate quantification of component features. This enables comprehensive process control, ensuring consistent yield and high-quality results. BUEHLER FibrMet is a reliable and efficient tool, providing an ideal solution for the grinding, lapping and polishing of ultra-thin wafers. It is a convenient and cost-effective tool that can help improve process efficiency and yield, while ensuring high-precision and quality results.